T0.4mm Mobile phone heat pipe

Name:

T0.4mm Mobile phone heat pipe

Parameter:

Diameter: 2mm

Flattening thickness: 0.4mm

Wick structure: Sintered

Mass production length: 50mm~150mm

*Bending fillet radius is generally not less than 2 times the diameter of the heat pipe

Range:

This ultra-thin heat pipe can be used in mobile phones and small handheld devices, providing a new solution for chip-level heat dissipation.

  • Product Description

Diameter: 2mm

Flattening thickness: 0.4mm

Wick structure: Sintered

Mass production length: 50mm~150mm

*Bending fillet radius is generally not less than 2 times the diameter of the heat pipe


T0.4mm手机热管

T0.4mm手机热管

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