One year ago, Sony’s flagship Xperia Z2 has already used an advanced heat pipe for cooling. In the meantime, the Media X06E from NEC in Japan have also used heat pipe, which was known as the world's first water-cooled mobile phone.

At that time, many radiator manufacturers predicted that heat pipes will be widely used by smart phones in the future. However, the heat pipe manufacturing technology wasn’t to fulfill the need. The diameter of the heat pipe was above 0.6 mm, and there were too few manufacturers were willing to install heat pipes on mobile phones.

Later, the heat pipes with 0.6 mm diameter were developed, but the mobile phone manufacturers were still not satisfied with the products. Therefore, thinner heat pipes were continuously developed.

Now, a Taiwanese radiator manufacturer said that since the current ultrabook and tablet heat pipe diameter has been reduced to 0.4-0.6 mm, in 2015, 0.4 mm heat pipe will be used in smart phones.

At present, most of the heat dissipation solution for smart phones is Graphite, but the copper heat pipes has higher heat dissipation efficiency with the same cost.

There are four 0.4 mm heat pipe manufacturers, including the Furukawa Electric and Fujikura in Japan, Chaun Choung Technology in Taiwan, and TaiSol Electronics.

The Sources said that heat pipes will definitely be used in smart phones in the future, but these manufacturers will face the challenge of keep making profits from mass production.