Although Song kept a low profile and used a new heat pipe for its flagship Xperia Z2 mobile phone, it still went to public. A Taiwan cooling system manufacturer expected that heat pipe will be widely used by other manufacturers and is becoming a new standard setting for mobile phones.

In fact, Xperia Z2 is not the first to “eat crabs”（trying new things）. The Media X06E from NEC has already used heat pipes last year, which is known as the world's first water-cooled mobile phone and was quite a hit in Japan.

Half a year ago, it was said that cooling system manufacturers had created heat pipes that could be used in mobile phones. Nowadays, the Furukawa Electric and Fujikura from Japan, the Chaun Choung Technology, TaiSol Electronics, Auras Technology, Asia Vital Components, and Yeh Chiang Technolog from Taiwan have all developed the ultra-thin heat pipes specifically for smartphones.

The diameter of heat pipes used on PCs is approximately 1-2 mm, ultrabooks and tablet PCs are approximately 1-1.2 mm and 0.8 mm, and those used for smart phones are further reduced to 0.6 mm, which are ready for mass production. .

In the future, the diameter of mobile phone heat pipes will continue to be shrunk to 0.4-0.5 mm.

At present, the most common material for cooling in mobile phones is graphite carbon fiber, but heat pipe provides higher thermal conductivity. Although the semiconductor technology has been improving, manufacturers will continue to compete with each other by using better parts. As power consumption and heat of mobile phone are losing control, the better cooling solutions are inevitable